FAW Group and Tsinghua Unigroup Join Forces to Boost China’s Automotive Semiconductor Industry
Shanghai (Gasgoo)- In a bid to strengthen cooperation in China’s automotive semiconductor sector, FAW Group and Tsinghua Unigroup recently inked a strategic partnership agreement in Beijing on May 16.
Photo credit: FAW Group
The strategic collaboration between the two entities will encompass various aspects of the automotive semiconductor industry, including domestic chip application, supply chain enhancement, joint research and development efforts, chip ecosystem development, and market-driven partnerships.
By combining their expertise, FAW Group and Tsinghua Unigroup aim to improve alignment between supply and demand and foster industrial synergy within the sector.
The partnership’s primary focus will be on establishing a robust automotive-grade chip ecosystem that covers chip design, wafer fabrication, packaging and testing, application selection, and integrated system solutions. Through collaborative projects, technological advancements, and capital investments, the two organizations aspire to set a new standard for collaboration between the chip and automotive industries.
