Honda and Renesas Collaborate to Develop High-Performance SoC for Software-Defined Vehicles
Honda Motor Co., Ltd. and Renesas Electronics Corporation have joined forces to create a cutting-edge system-on-chip (SoC) for software-defined vehicles (SDVs). This new SoC is set to deliver exceptional AI performance of 2,000 TOPS while maintaining a remarkable power efficiency of 20 TOPS/W. It is intended for use in upcoming models of the “Honda 0 (Zero) Series,” Honda’s upcoming electric vehicle (EV) lineup, particularly those scheduled for release in the late 2020s. The partnership was announced at a Honda press conference at CES 2025 in Las Vegas, Nevada on January 7.
Honda is dedicated to developing unique SDVs that offer a personalized mobility experience for each customer within the Honda 0 Series. These vehicles will adopt a centralized electric/electronic (E/E) architecture that consolidates multiple electronic control units (ECUs) responsible for various vehicle functions into a single ECU. The core ECU, acting as the SDV’s central hub, will oversee critical functions like Advanced Driver Assistance Systems (ADAS), Automated Driving (AD), powertrain control, and comfort features all within one unit. To achieve this seamless integration, the ECU necessitates a high-performance SoC that surpasses traditional systems in processing power while maintaining low power consumption.
In pursuit of Honda’s vision for SDVs, Honda and Renesas have come together to develop a top-of-the-line SoC compute solution tailored for core ECUs. This SoC, utilizing TSMC’s advanced 3-nm automotive process technology, promises a significant reduction in power consumption. Furthermore, it introduces a system that employs multi-die chiplet technology by combining Renesas’ fifth-generation R-Car X5 SoC series with an AI accelerator optimized for Honda’s independently developed AI software.
By combining these elements, the system aims to achieve industry-leading AI performance with remarkable power efficiency. The SoC chiplet solution is designed to deliver the necessary AI performance for advanced functions like AD, all while keeping power consumption at a minimum. Chiplet technology offers the flexibility to create customized solutions and allows for future upgrades to enhance functionality and performance.
This collaboration between Honda and Renesas builds upon their longstanding partnership. By integrating advanced semiconductor and software innovations into the Honda 0 Series, this agreement will elevate the mobility experience for customers, setting a new standard for SDVs in the automotive industry.
